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PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition

    Buy cheap PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition from wholesalers
     
    Buy cheap PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition from wholesalers
    • Buy cheap PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition from wholesalers
    • Buy cheap PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition from wholesalers
    • Buy cheap PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition from wholesalers
    • Buy cheap PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition from wholesalers

    PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition

    Ask Lasest Price
    Brand Name : ROYAL
    Model Number : RTAS
    Certification : CE
    Price : depends on
    Payment Terms : L/C, T/T
    Supply Ability : 10 sets per month
    Delivery Time : 10 to 12 weeks
    • Product Details
    • Company Profile

    PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition

    Circuit Board Conductive Thin Film Deposition by PVD DC Sputtering Process, Copper plating, Au Sputteringdeposition


    ------Large Capacity, Flexible Modules Design, Precised Manufacturing.


    Technical Advantages:


    The DPC-RTAS1215+ Sputtering system is the upgraded version of the original ASC1215 model, the newest system has several advantages:


    Higher Efficient Process:
    1. Double sided coating is available by turnover fixture design
    2. Up to 8 standard planar cathode flanges for multiple sources
    3. Large capacity up to 2.2 ㎡ ceramic chips per cycle
    4. Fully Automation, PLC+Touch Screen, ONE-touch control system


    Lower Production Cost:
    1. Equipped with 2 magnetic suspension molecular pumps, fast starting time, free maintenance;
    2. Maximum heating power;
    3. Octagonal shape of chamber for optimum space using, up to 8 arc sources and 4 sputtering cathodes for fast deposition of coatings


    The DPC process- Direct Plating Copper is an advanced coating technology applied with LED and semiconductors in electronic industries. One typical application is Ceramic Radiating Substrate. Copper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, has above all one big advantage compared to traditional manufacturing methods: DBC LTCC HTCC have much lower production costs.


    Royal Technology’s team collaborated with our customer to develop the DPC process successfully applying PVD sputtering technology.


    Applications of DPC:
    HBLED
    Substrates for solar concentrator cells
    Power semiconductor packaging including automotive motor control
    Hybrid and electric automobile power management electronics
    Packages for RF
    Microwave devices


    Technical Specifications


    DescriptionDPC-RTAS1215+
    Chamber Height (mm)1500
    Chamber diameter (mm)φ1200
    Sputtering Cathodes Mounting Flange4
    Ion Source Mounting Flange1
    Arc Cathodes Mounting Flange8
    Satellites (mm)16 x Φ150
    Pulsed Bias Power (KW)36
    Sputtering Power (KW)DC36 + MF36
    Arc Power(KW)8 x 5
    Ion Source Power (KW)5
    Heating Power (KW)36
    Effective Coating Height (mm)1020
    Magnetic Suspension Molecular Pump2 x 3300 L/S
    Roots Pump1 x 1000m³/h
    Rotary Vane Pump1 x 300m³/h
    Holding Pump1 x 60m³/h
    Capacity2.2
    Installation Area ( L x W x H) mm4200*6000*3500

    HMI + Touch Screen Operation System



    Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.


    Quality PVD Nickle and Copper Sputtering Thin Film Coating Machine, Au Gold Conductive Film Deposition for sale
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