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Brand Name : | ROYAL |
Model Number : | RTAS1250 |
Certification : | CE |
Price : | negotiable |
Payment Terms : | L/C, D/A, D/P, T/T |
Supply Ability : | 6 sets per month |
Delivery Time : | 12 weeks |
TiN gold Metal Mid-Frequency Magnetron Sputtering Coating Machine / MF Sputtering
System
Magnetron Sputtering Vacuum Coating is a type of PVD Ion Plating
surface treatment menthod. It can be used for the production of
conducting or non conducting films, on many types materials:
metals, glass, ceramic, plastic, metal alloy. The sputtering
deposition concept: the coating material (target, also named
cathode) and the work pieces (substrates, also called anode) are
placed into the vacuum chamber and the pressure is reduced.
Sputtering is initiated by placing the target under a voltage
differintial and introducing Argon gas that form argon ions (glow
discharge). The argon ions accelerate toward the process target and
displace target atoms. These sputtering atoms are then condensed
onto the substrate and form very thin and high uniformity layer.
Various colors can be achieved by introducing reactive gases like,
nitrogen, oxgen, or acetylene into hte sputter gass during coating
process.
Magnetron Sputtering Models: DC Sputtering, MF Sputtering, RF
Sputtering
What is MF Sputtering?
Compared with DC and RF sputtering, Mid-Frequency sputtering has
become a main thin film sputtering technique for mass production of
coating, particularly for the film deposition of dielectric and
non-conductive film coatings on surfaces such as optical coatings,
solar panels, multiple layers, composite material film etc.
It is replacing RF sputtering due to it operated with kHz rather
than MHz for a much faster deposition rate and also can avoid the
Target poisoning during compound thin film deposition like DC.
MF sputtering targets always existed with two-sets. Two cathodes
are used with an AC current switched back and forth between them
which cleans the target surface with each reversal to reduce the
charge build up on dielectrics that leads to arcing which can spew
droplets into the plasma and prevent uniform thin film growth---
which is what we called Target Poisoning.
MF Sputtering System Performance
1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.
2. Operating Vacuum Pressure: 1.0×10-4 Torr.
3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)
4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag,
Au, Ti, Zr, Cr, TiN, TiC, TiAlN, CrN, CrC, etc.
5. Operating Model: Full Automatically /Semi-Auto/ Manually
MF Sputtering System Structure
The vacuum coating machine contains key completed system listed
below:
1. Vacuum Chamber
2. Rouhging Vacuum Pumping System (Backing Pump Package)
3. High Vacuum Pumping System ( Magnetically Suspension Molecular
Pump)
4. Electrical Control and Operation System
5. Auxiliarry Facility System (Sub System)
6. Deposition System: MF sputtering cathode, MF power supply, Bias
Power Supply Ion source for optional
MF Sputtering System RTSP1212-MF Specifications
MODEL | RTSP1212-MF | ||||||
TECHNOLOGY | MF Magnetron Sputtering + Ion Plating | ||||||
MATERIAL | Stainless Steel (S304) | ||||||
CHAMBER SIZE | Φ1250*H1250mm | ||||||
CHAMBER TYPE | Cylinder, vertical, 1-door | ||||||
SPUTTERING SYSTEM | Exclusively design for thin black film deposition | ||||||
DEPOSITION MATERIAL | Aluminum, Silver, Copper, Chrome, Stainless Steel, Nickel | ||||||
DEPOSITION SOURCE | 2 sets MF Cylindrical Sputtering Targets + 8 Steered Cathodic Arc Sources | ||||||
GAS | MFC- 4 ways, Ar, N2, O2, C2H2 | ||||||
CONTROL | PLC(Programmable Logic Controller) + | ||||||
PUMP SYSTEM | SV300B - 1 set (Leybold) | ||||||
WAU1001 - 1 sets (Leybold) | |||||||
D60T- 2sets (Leybold) | |||||||
Turbo Molecular Pumps: 2* F-400/3500 | |||||||
PRE-TREATMENT | Bias power supply: 1*36 KW | ||||||
SAFETY SYSTEM | Numerous safety interlocks to protect operators | ||||||
COOLING | Cold Water | ||||||
POWER ELECTRICAL | 480V/3 phases/60HZ ( USA compliant) | ||||||
460V/3 phases/50HZ ( Asia compliant) | |||||||
380V/3 phases/50HZ ( EU-CE compliant) | |||||||
FOOTPRINT | L3000*W3000*H2000mm | ||||||
TOTAL WEIGHT | 7.0 T | ||||||
FOOTPRINT | ( L*W*H) 5000*4000 *4000 MM | ||||||
CYCLE TIME | 30~40 minutes (depending on substrate material, substrate geometry and environmental conditions) | ||||||
POWER MAX.. | 155 KW | ||||||
AVERAGE POWER | 75 KW |
We have more models for your selection!
Please contact us for more specifications, Royal Technology is
honored to provide you total coating solutions.
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