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RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine

    Buy cheap RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine from wholesalers
     
    Buy cheap RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine from wholesalers
    • Buy cheap RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine from wholesalers

    RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine

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    Brand Name : ROYAL
    Model Number : RTSP1215
    Certification : CE
    Price : negotiable
    Payment Terms : L/C, T/T
    Supply Ability : 6 sets per month
    Delivery Time : 14 weeks
    • Product Details
    • Company Profile

    RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine

    Applications

    The RTSP1215 machine is tailor-designed and made for cooper PCBs gold plating by sputtering deposition technology.

    Everyone who are involved with the PCB industry knows that PCBs which have copper finishes on the surface requires a protective layer to protect it against from oxidize and deteriorate.

    2 Years ago, we received a request from our customer, they were looking for a coating solution generate a fine gold and bronze colors on the copper PCBs which used for 5G SIM card, social security cards and smart cards module. We spent 6 months in R&D, over 20 times experiment to finalized the proper coating processes. In March 2020, we delivered the machine to customer’s site with a high accomplishment.


    RTSP1215 plating system can deposit the metals: Au gold, Ag silver, Cu copper conductive families films; corrosion resistance metal families: Tantalum(Ta), Nickle (Ni), Chrome (Cr) etc.
    compounded films: carbon-based metal films, Nitride metal films.

    PVD Gold Plating Advantages

    Environmentally friendly process

    Much lower production cost compared with conventional Gold electroplating

    Excellent Life

    Film thickness and uniformity are well controlled

    Widely available, more options for end user

    Key Features

    Multiple deposition sources for fast deposition rate

    Strong vacuum pumping system for a short cycle

    Anode linear ion source to improve adhesion and high density of deposited films

    6 units standard planar cathodes mounting flanges

    Flexible coating processes applied

    Modular structure design for fast exchange of cathodes and targets

    5G circuit microchip SIM card emblem isolated on white background


    Technical Specifications

    Model: RTSP1215

    Chamber Material: SUS304

    Chamber Size: Φ1200*1500mm (H)

    Deposition Technology: Magnetron sputtering

    Targets: Ta, Au, Ag, Ti,Cr,Zr, Ni, Cu, Graphite (C) etc

    Vacuum Pumps: Mechanical Pump: 1x300m³/hr

    Holding Pump:1x60m³/hr

    Roots Pump: 1x300L/S

    Turbo Molecular pump: 2x3500L/S

    Gas System: MFC for reactive gas and inert working gas

    Protective System: HMI program with Multiple Self-Lock design

    Operation & Control System: PLC + Touch Screen

    Cooling System: Recycle Cooling water

    Heating System: Heaters with PDI thermal couple

    Max. Power Consumption 130KW Approx.

    Average Power Consumption 70KW Approx.

    Layout


    Insite

    Built Time: 2020

    Location: Shanghai, China




    Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

    Quality RTSP1215 Printed Circuit Board PCB Gold Plating Equipment TiN Gold Sputtering Machine for sale
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